Ming Lei (Senior Member, IEEE) received the Ph.D. degree in electrical engineering from the Beijing University of Posts and Telecommunications (BUPT), Beijing, China, in 2003. Since January 2018, he has been a Senior Platform Solution Architect at Intel Corporation. Prior to this, he held senior R&D positions in several world-renowned research institutions and high-tech companies such as the National Institute of Information and Communications Technology (NICT) of Japan, Intel Labs, NEC Laboratories, Samsung Electronics, and Huawei Technologies. From February to September 2013, he was with the Stanford University as a Senior Visiting Scholar. His research interests include deep learning, sensor fusion, radar signal processing, and artificial intelligence in wireless communications. He has published more than 170 peer-reviewed technical papers in international journals and conferences. He holds 37 granted U.S. patents. Dr. Lei is a Senior Member of IEEE. He was a recipient of the Best Paper Award at IEEE CHINACOM 2013. He has served as a Reviewer for IEEE Transactions on Wireless Communications, IEEE Transactions on Communications, IEEE Communications Letters, IEEE Transactions on Mobile Computing, IEEE Transactions on Vehicular Technology, IEEE Internet of Things Journal, and IEEE Vehicular Technology Magazine, and as a TPC member for many IEEE conferences. From April 2015 to January 2017, he was the Vice Chair of the Wireless World Research Forum (WWRF) where he established the 5G Vertical Industry Platform (5G VIP) for promoting 5G connectivity in IoT vertical industries. He is currently an Expert Advisor to the C-V2X Working Group of the IMT-2020 (5G) Promotion Group. He is also an officially recognized Technical Leader in AI sensor fusion and V2X by Intel Corporation.