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Special Issue

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With the deployment of 5G networks and the standardization of 5G-Advanced, both the academia and the industry are exploring actively into future technologies for next generation wireless communication systems. Reconfigurable Intelligent Surfaces (RISs) have been envisaged to reduce the deployment costs and energy consumption, as well as improve the spectral efficiency of wireless networks by artificially re-configuring the propagation environment of electromagnetic waves. RIS-based transmission, in which the large number of small, low-cost, and passive elements on RIS only reflect the incident signal with an adjustable reflection amplitude and phase shift without requiring a dedicated energy source for radio frequency processing, decoding, or encoding, is completely different from existing active relays and open a new area of research for wireless communications. RISs are being discussed actively in regional and global standardization development organizations and are likely to become a critical component of 5G, 5G-Advanced, and 6G networks.

Motivated by the current trends in the study and early standardization efforts on RIS, this Special Issue (SI) targets to assemble cross-cutting and high-quality magazine papers in the following areas:

  • Analysis of RIS-assisted communication capacities.
  • Practical use cases for RIS in future networks.
  • Design, testing, and trials of RIS prototypes.
  • Communication protocols for RIS-assisted communication systems.
  • Autonomous deployment of RIS.
  • Centralized/distributed machine learning for RIS.
  • Channel modeling for RIS.
  • Physical models of RIS.
  • Channel estimation and feedback for RIS-assisted networks.
  • RIS for integrated sensing and communication.
  • RIS for mobile edge computing.
  • RIS for sub-THz and THz bands.
  • RIS-enabled space-air-ground integrated networks.
  • RIS for drones and vehicular networks.

Submission Guidelines

Manuscripts should conform to the standard format indicated in the Information for Authors section of the Paper Submission Guidelines. All manuscripts to be considered for publication must be submitted by the deadline through Manuscript Central. Select "December 2024/ Reconfigurable Intelligent Surfaces" from the drop-down menu of Topic/Series titles.

Important Dates

Manuscript Submission Deadline: 30 April 2024 (Extended Deadline)
Authors’ Revision Notification Date: 1 June 2024
Revised Manuscript Submission Deadline: 15 July 2024
Final Decision Notification Date: 15 August 2024
Camera-ready Files Due: 30 August 2024
Guest Editorial/Column: 15 September 2024
Expected Publication Date: December 2024

Guest Editors

Ruiqi (Richie) Liu (Lead)
ZTE Corporation, China

Satoshi Nagata
NTT Docomo, Japan

Xingqin Lin
NVIDIA, USA

Ertugrul Basar
Koç University, Turkey

Marco Di Renzo
Centrale Supelec, France

For inquiries regarding this Special Issue, please contact the Lead Guest Editor.

The SI is technically sponsored by ComSoc SPCC-TC.